BrightSpots 3D IC Forum

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BrightSpots 3D IC Forums -- Now Closed

3D IC Technology Progress & Limitations
3D IC Supply Chain Issues
3D IC Standards
Featured Forum: Taller vs. Smaller: Moore's Law vs. 3D IC--An Extended Discussion from the 2009 Lithography Workshop

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3D IC Technology Progress & Limitations (Discussions: 8)

Last Post: Re:How should 3D ICs be tested...
By Françoise Von Trapp on Jul. 26, 2009

3D IC Supply Chain Issues (Discussions: 5)

Last Post: Re:What is delaying 3D IC tech...
By Françoise Von Trapp on Jul. 26, 2009

3D IC Standards (Discussions: 3)

Last Post: Re:Are standards necessary?
By Françoise Von Trapp on Jul. 26, 2009

Lithography Workshop: Smaller vs Taller. Extended Discussion (Discussions: 7)

Last Post: Re:How many 3D roadmaps do we ...
By Robert Patti on Jul. 17, 2009

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Françoise in 3D

3D makes the test community “To Do” list

Jan. 28, 2010

I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking place in my backyard in Mesa, AZ. Read More>>

BetaBlog

Praying for Jobs ex machina

Jan. 27, 2010

… and after years of tribulation with most people gone to other lands, a great fear was upon the land of Publishing for all business models were lost along with all hope. The web had washed so much away, and the multitudes prayed that the one true Jobs would intervene and with compassion bestow upon [...] Read More>>

Perspectives From the Leading Edge

On Copper Diffusion, Gettering and the Denuted Zone

Feb. 06, 2010

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Part 5: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements

By Karen Do on Jul 20, 2009

Part 4: 3D vs. Traditional Scaling

By Karen Do on Jul 20, 2009

Part 3: Thin-wafer Handling Temporary Bonding/Debonding

By Karen Do on Jul 20, 2009

Part 2: Wire Bonding vs. TSVs and Design Tools for 3D

By Karen Do on Jul 20, 2009

Part 1: Defining 3D at the Packaging Level and the Circuit Level

By Karen Do on Jul 20, 2009

This is part 1 of 5 highlight videos stemming from a press- and analyst-exclusive panel event ... Read More>>

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	Sitaram Arkalgud 3D Technologies
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	David Kirsch 3D Technologies
	Ed Korczynski Process Integration
	Jim Walker Business Analyst
	Jonathan White Product Development
	Frank Schellenberg 3D Technologies
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BrightSpots 3D IC Forums (4 forums , 23 discussions)

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